| 摘要 |
An apparatus for chip removing machining includes first and second parts which are intercoupled by a coupling. The coupling includes two interacting surfaces disposed on the first and second parts, respectively. The interacting surfaces are profiled to intermesh with one another to define an intermeshing region of the coupling. Each of the surfaces is profiled with first and second sets of grooves which define first and second main directions, respectively, which extend transversely to one another. At least one groove on each of the surfaces extends across less than the entire intermeshing region, wherein the surfaces define only one coupling position for the first and second parts. |
