发明名称 |
Embedded metallic deposits |
摘要 |
A method of making a set of metallic deposits includes injection molding a substrate, where a pattern of channels is in a surface of the substrate, applying a metallic layer on the surface, to form metallic deposits in the pattern, and removing a portion of the metallic layer, to expose a portion of the surface. The set of metallic deposits can form an electrode set for an electrochemical sensor strip.
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申请公布号 |
US2004000371(A1) |
申请公布日期 |
2004.01.01 |
申请号 |
US20020307635 |
申请日期 |
2002.12.02 |
申请人 |
BHULLAR RAGHBIR S.;FJELSTAD JOSEPH C. |
发明人 |
BHULLAR RAGHBIR S.;FJELSTAD JOSEPH C. |
分类号 |
G01N27/30;G01N27/327;G01N27/403;H05K3/00;H05K3/04;H05K3/10;H05K3/14;H05K3/16;(IPC1-7):C25D3/50;C25D17/10;G01N27/26 |
主分类号 |
G01N27/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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