发明名称 Embedded metallic deposits
摘要 A method of making a set of metallic deposits includes injection molding a substrate, where a pattern of channels is in a surface of the substrate, applying a metallic layer on the surface, to form metallic deposits in the pattern, and removing a portion of the metallic layer, to expose a portion of the surface. The set of metallic deposits can form an electrode set for an electrochemical sensor strip.
申请公布号 US2004000371(A1) 申请公布日期 2004.01.01
申请号 US20020307635 申请日期 2002.12.02
申请人 BHULLAR RAGHBIR S.;FJELSTAD JOSEPH C. 发明人 BHULLAR RAGHBIR S.;FJELSTAD JOSEPH C.
分类号 G01N27/30;G01N27/327;G01N27/403;H05K3/00;H05K3/04;H05K3/10;H05K3/14;H05K3/16;(IPC1-7):C25D3/50;C25D17/10;G01N27/26 主分类号 G01N27/30
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