发明名称 Method for fabricating a nitrided silicon-oxide gate dielectric
摘要 A method of fabricating a gate dielectric layer. The method comprises: providing a substrate; forming a silicon dioxide layer on a top surface of the substrate; exposing the silicon dioxide layer to a plasma nitridation to convert the silicon dioxide layer into a silicon oxynitride layer; and performing a spiked rapid thermal anneal of the silicon oxynitride layer.
申请公布号 US2004002226(A1) 申请公布日期 2004.01.01
申请号 US20020187572 申请日期 2002.07.01
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BURNHAM JAY S.;CHOU ANTHONY I.;FURUKAWA TOSHIHARU;GIBSON MARGARET L.;NAKOS JAMES S.;SHANK STEVEN M.
分类号 H01L21/318;H01L21/28;H01L21/314;H01L21/324;H01L21/336;H01L29/49;H01L29/51;H01L29/78;H01L29/786;(IPC1-7):H01L21/336;H01L21/31;H01L21/469 主分类号 H01L21/318
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