发明名称 |
Process for creating holes in polymeric substrates |
摘要 |
Provided is a process for creating a via through a substrate including the steps of (a) providing a substantially void-free film of a curable composition; (b) applying a resist onto the curable film; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the curable film; (e) removing the exposed areas of the curable film to form holes through the curable film; and (f) heating the curable film of step (e) to a temperature and for a time sufficient to cure the curable composition. Also disclosed is a process of fabricating a circuit assembly which includes building patterned circuit layers upon a substrate that has vias provided by the aformentioned process.
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申请公布号 |
US2004000426(A1) |
申请公布日期 |
2004.01.01 |
申请号 |
US20020183674 |
申请日期 |
2002.06.27 |
申请人 |
OLSON KEVIN C.;WANG ALAN E. |
发明人 |
OLSON KEVIN C.;WANG ALAN E. |
分类号 |
H05K3/42;H05K3/00;H05K3/46;(IPC1-7):H05K1/03;B21B1/00;B21C27/00;B21D28/00;B32B3/10;G03F7/20;G03F7/30;G03F7/40;H01R12/04;H05K1/09;H05K1/11 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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