发明名称 Wafer shipping device and storage method for preventing fluoridation in bonding pads
摘要 A wafer-shipping device and a wafer storage method for protecting bonding pads from fluoridation. First, at least one through hole is drilled in the shipping box. The wafer is then placed in the shipping box. A packaging bag containing the shipping box is put into a vacuum packaging machine to remove air from the packaging bag and the shipping box. A dry inert gas is then introduced into the packaging bag and the shipping box until approaching atmospheric pressure as so to prevent the shipping box from collapse. The packaging bag is then sealed.
申请公布号 US2004000495(A1) 申请公布日期 2004.01.01
申请号 US20030600539 申请日期 2003.06.23
申请人 LEE HUNG-WEN;WU CHING-PING;SU YEN-HUEI 发明人 LEE HUNG-WEN;WU CHING-PING;SU YEN-HUEI
分类号 B65D77/00;B65D81/20;H01L21/673;(IPC1-7):B65B31/00;B65D85/57 主分类号 B65D77/00
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