LIQUID-TO-AIR COOLING SYSTEM FOR PORTABLE ELECTRONIC AND COMPUTER DEVICES

摘要

A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portable computer. The heat exchange assembly includes a hollow channel for carrying coolant, as well as a thermally conductive plate and air-cooled fins. The hollow channel is coupled to one main surface of the plate, while the air-cooled fins are coupled to an opposite main surface of the plate. A conduit carries coolant between the cold plate assembly and the hollow channel of the heat exchange assembly, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange assembly in a manner to remove heat from the heat-generating electronic component.