发明名称 Heat dissipation assembly
摘要 A heat dissipation assembly for dissipating heat from a CPU (60) mounted to a PCB (70) includes a heat sink (40), two wire clips (30), a fixing frame (20) secured to the heat sink, and a fan (10) attached to the fixing frame. Two grooves (402) are defined in the heat sink. Each clip has a central portion (302) received in a corresponding groove, and two arms (304) extending from the central portion. A hook (306) is formed at an end of each arm. An offset part is formed at the central portion, for limiting rotation of the clip in the groove. The fixing frame includes a top wall (212) and two side walls (202). Two cutouts (206) are defined in each side wall, corresponding to the grooves of the heat sink. Opposite ends of the central portion of each clip protrude out through corresponding cutouts of the fixing frame.
申请公布号 US2004001315(A1) 申请公布日期 2004.01.01
申请号 US20030338424 申请日期 2003.01.07
申请人 LI YUE-JUNE 发明人 LI YUE-JUNE
分类号 H01L23/40;H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/40
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