| 摘要 |
PURPOSE: A mobile phone embedded type camera module and a method for manufacturing the same are provided to reduce the manufacturing cost by manufacturing an embedded type camera module only by using an FPC(flexible printed circuit). CONSTITUTION: An FPC is manufactured to have a plated pattern(10a) for mounting an image sensor chip(20-1) packaged in a leadless chip carrier(LCC) type, another plated pattern for mounting a DSP(digital signal processing) chip(30) and peripheral chips(32), and the other plated pattern for mounting a connector. A reinforcing plate is attached to a bottom surface corresponding to the plated pattern for mounting the image sensor chip in the FPC. The image sensor chip, the DSP chip, the peripheral chips, and the connector are correspondingly mounted at the plated patterns of a top of the FPC. The FPC is bent and attached to place DSP chip and the peripheral chips at the back of the image sensor chip. A housing(50) with a lens(52) is attached to a top of the image sensor.
|
