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发明名称 SEMICONDUCTOR DEVICE AND ITS PRODUCING METHOD
摘要 <p>A semiconductor device comprises a substrate, a pad electrode formed on the substrate, and a bump electrode formed on the pad electrode. The pad electrode has a scratch of projections and depressions. A pattern covering the scratch of projections and depressions is formed between the pad electrode and bump electrode.</p>
申请公布号 WO2004001839(A1) 申请公布日期 2003.12.31
申请号 WO2002JP06245 申请日期 2002.06.21
申请人 FUJITSU LIMITED;CHIBA, SHUICHI;ISHIGURI, MASAHIKO;MURATA, KOICHI;WATANABE, EIJI;TAMAGAWA, MICHIAKI;SATOH, AKIRA;TOIDA, YASUSHI;MISAWA, KAZUHIRO 发明人 CHIBA, SHUICHI;ISHIGURI, MASAHIKO;MURATA, KOICHI;WATANABE, EIJI;TAMAGAWA, MICHIAKI;SATOH, AKIRA;TOIDA, YASUSHI;MISAWA, KAZUHIRO
分类号 H01L21/288;H01L21/60;H01L23/00;H01L23/485;H01L23/544;H01L29/40;H01L29/78;(IPC1-7):H01L21/60 主分类号 H01L21/288
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