摘要 |
An interface structure (400) includes first(402a) and second portions(402b). The first portion has physical dimensions that are compatible with the docking area (356) of an associated device tester(352), and includes a first socket (304) configured to receive a first BGA package (100). The second portion, which is adjacent to and contiguous with the first portion, extends laterally beyond the docking area of the device tester to provide additional testing area that may include one or more additional sockets(404). In one embodiment, the second portion includes a second socket (404) configured to receive a second BGA package (200), wherein the second size and configuration of second BGA package are different from the size and configuration of the first BGA package. |