发明名称 METAL-CERAMIC SUBSTRATE FOR ELECTRIC CIRCUITS OR MODULES, METHOD FOR PRODUCING ONE SUCH SUBSTRATE AND MODULE COMPRISING ONE SUCH SUBSTRATE
摘要 The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer consisting of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
申请公布号 WO2004002204(A1) 申请公布日期 2003.12.31
申请号 WO2003DE01242 申请日期 2003.04.11
申请人 CURAMIK ELECTRONICS GMBH;SCHULZ-HARDER, JUERGEN;HABERL, PETER 发明人 SCHULZ-HARDER, JUERGEN;HABERL, PETER
分类号 H01L23/12;H01L23/373;H01L25/16;H05K1/03;H05K1/09;H05K3/28;H05K3/46 主分类号 H01L23/12
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