IMPROVED INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT PACKAGE

摘要

The present invention relates to an integrated circuit package (10) and method of manufacturing an integrated circuit package (10). In one aspect, the present invention relates to an integrated circuit package (10) including a lead frame (100) having a lead (101) with an inner pad (102) and an outer pad(106) connected by a connection member (115); wherein a region of the inner pad 9102) and a region of the outer pad (106) are separated by a channel (109) extending through a width of the lead (101). Such an integrated circuit package (10) further includes a semiconductor die (110) electrically coupled with the inner pad (102) of the lead (101), and an encapsulant material (120) encapsulating at least a portion of said lead frame (101), wherein a portion of said outer pad (106) is exposed. In another aspect, the present invention relates to a method including providing a matrix of lead frames, each of the lead frames having a lead (101), forming a channel (109) extending through a width of the lead to create an inner pad (102), an outer pad (106) and a connection member (115) in the lead (101), electrically coupling a semiconductor die (110) with the inner pad (102), and encapsulating at least a portion of the lead frame (100) such that at least a portion of the outer pad (106) is exposed.