| 摘要 |
An LED packaging method, including: forming an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region; forming an electrical insulator (20) on the peripheral region; forming an electrically conductive material (22,23) on the electrical insulator (20); mounting a semiconductor die (4) directly to the base within the receptacle (2), the die (4) incorporating at least one light emitting diode (LED); and forming one or more electrical connections (14-19) between the electrical electrically conductive material (22,23) and one or more electrical contacts of the die (4) to provide a packaged LED. |
