PHOTODIODE HAVING SUB-MOUNT AND LASER DIODE PACKAGE USING THE SAME

摘要

PURPOSE: A photodiode having a sub-mount and a laser diode package using the same are provided to improve a radiative characteristic by exposing a predetermined area of a metal layer corresponding to a radiating area of a laser. CONSTITUTION: A photodiode having a sub-mount includes a semiconductor substrate(13), a light receiving region(12), a metal layer(11), and an adhesive layer. A lower electrode is formed on a lower face of the semiconductor substrate(13). The light receiving region(12) is formed on an upper face of the semiconductor substrate(13). The light receiving region(12) has the same pattern as the output beam in order to receive the output beam from a laser diode(1). The metal layer(11) is adjacent to the light receiving region(12). The metal layer(11) is formed on the remaining upper face of the semiconductor substrate(13) except for the light receiving region(12). The adhesive layer is installed on the metal layer(11) of the semiconductor substrate(13) in order to mount the laser diode(1).