发明名称 |
DRY METHOD AND APPARATUS BY INSTANT DECOMPRESSING AND HEATING |
摘要 |
PURPOSE: A dry apparatus using instant decompressing and heating is provided to temporarily vaporize and dry water drops remaining on a wafer by loading the wafer into a dry chamber installed in a decompression chamber and by opening a decompression valve between the dry chamber and the decompression chamber. CONSTITUTION: The decompression chamber(100) is prepared. The inner pressure in the decompression chamber is reduced as much as an atmospheric pressure or lower with a vacuum pump. The dry chamber(102) is installed in the decompression chamber to dry the loaded wafer. The decompression valve(110) is installed in the wall of the dry chamber to decompress the inner pressure state of the dry chamber so that the decompression chamber becomes a low pressure state when the decompression valve gets open. A heating unit heats the inside of the dry chamber.
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申请公布号 |
KR20030097263(A) |
申请公布日期 |
2003.12.31 |
申请号 |
KR20020034552 |
申请日期 |
2002.06.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, IN SEOK;KO, YONG SEON;LEE, GWANG UK |
分类号 |
H01L21/304;H01L21/00;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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地址 |
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