发明名称 HYBRID PRINTED CIRCUIT BOARD FOR MEMORY MODULE
摘要 PURPOSE: A hybrid printed circuit board is provided to satisfy the electronic characteristics of high frequency at a low cost. CONSTITUTION: A hybrid printed circuit board comprises an insulating layer having a dielectric constant of 4.0 or lower, wherein the insulating layer is deposited on the top, bottom or top and bottom of a copper layer having a circuit pattern corresponding to the signal line related to a signal input/output; and an FR4 insulating layer deposited between other layers. The insulating layer is a Teflon-based, polyphenylene ether-based or cyanate ester-based insulating layer.
申请公布号 KR20030097028(A) 申请公布日期 2003.12.31
申请号 KR20020034155 申请日期 2002.06.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO, YEONG SANG;LEE, BYEONG HO;LEE, DONG HWAN;LEE, YANG JE;PARK, JONG YEONG;YANG, DEOK JIN
分类号 H05K1/05;(IPC1-7):H05K1/05 主分类号 H05K1/05
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