发明名称 |
HYBRID PRINTED CIRCUIT BOARD FOR MEMORY MODULE |
摘要 |
PURPOSE: A hybrid printed circuit board is provided to satisfy the electronic characteristics of high frequency at a low cost. CONSTITUTION: A hybrid printed circuit board comprises an insulating layer having a dielectric constant of 4.0 or lower, wherein the insulating layer is deposited on the top, bottom or top and bottom of a copper layer having a circuit pattern corresponding to the signal line related to a signal input/output; and an FR4 insulating layer deposited between other layers. The insulating layer is a Teflon-based, polyphenylene ether-based or cyanate ester-based insulating layer.
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申请公布号 |
KR20030097028(A) |
申请公布日期 |
2003.12.31 |
申请号 |
KR20020034155 |
申请日期 |
2002.06.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO, YEONG SANG;LEE, BYEONG HO;LEE, DONG HWAN;LEE, YANG JE;PARK, JONG YEONG;YANG, DEOK JIN |
分类号 |
H05K1/05;(IPC1-7):H05K1/05 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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