| 摘要 |
PURPOSE: Semiconductor dry etching equipment is provided to be capable of preventing the dielectric breakdown of an edge ring and prolonging the lifetime of an electrostatic chuck by improving the structure of the equipment. CONSTITUTION: Semiconductor dry etching equipment is provided with at least one electrostatic chuck(204-1,204-2,204-3) for loading a wafer, at least one edge ring(201,203) for enclosing the peripheral portion of each electrostatic chuck, and an insulation ring(102) installed between the edge rings. At this time, the electrostatic chuck has a larger diameter than that of the wafer. Preferably, the semiconductor dry etching equipment further includes a wafer guide(105) located at the upper portion of the edge ring for enclosing the wafer. Preferably, the wafer guide is located at the upper portion of the resultant structure between the uppermost electrostatic chuck and the uppermost edge ring.
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