POLISHING STATION OF CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A polishing station of a chemical mechanical polishing(CMP) apparatus is provided to prevent a wafer unloading error by stably unloading a semiconductor wafer from a transfer stage. CONSTITUTION: A turntable on which a polishing pad is mounted is formed on a polishing station. A polishing head(162) has a membrane(168) whose surface contacts the wafer, maintaining the wafer and pressing the wafer over the turntable. The polishing station includes a wafer transfer stage(120) for loading/unloading the wafer into/from the polishing head. The wafer transfer stage includes a pedestal(122) and a fluid supply apparatus. The wafer is placed on the pedestal. When the wafer is unloaded from the polishing head to the pedestal, the fluid supply apparatus supplies fluid to a gap between the wafer and the membrane to reduce the surface tension between the wafer and the membrane.