HIGH VOLTAGE BGA PACKAGE, HEAT SPREADER USED FOR THE SAME, AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A high voltage BGA(Ball Grid Array) package, a heat spreader used for the same, and a manufacturing method thereof are provided to be capable of preventing the damage of a semiconductor chip due to static electricity by reducing the capacitance between the heat spreader and the semiconductor chip. CONSTITUTION: A high voltage BGA package is provided with a PCB(Printed Circuit Board)(200) having a predetermined through hole(200a) at the center portion, a connecting pad(201) formed at the lower portion of the PCB, a plurality of solder balls(210) shaped into a matrix type structure for enclosing the through hole at the lower portion of the PCB, and a heat spreader(110) formed at the upper portion of the PCB. At this time, the heat spreader includes an electrical insulating layer having a high thermal conductivity. The high voltage BGA package further includes a semiconductor chip(101) located at the lower portion of the heat spreader and a passive layer(230) formed at the lower portion of the semiconductor chip.