| 摘要 |
PURPOSE: A chip stack package is provided to make two chips function as one chip by interconnecting chips of a roughness type while using flexible tape and by electrically connecting the chips with a circuit pattern of a substrate while the chips are attached to the substrate. CONSTITUTION: The first and second semiconductor chips have concave pads(41a) and convex pads(42a) in corresponding positions. The flexible tape(43) has a patterned metal interconnection between upper and lower adhesive materials. The first and second semiconductor chips are attached to each other by interposing the flexible tape whose adhesive material portion is open so that the concave pads and the convex pads are electrically connected to each other. The first and second semiconductor chips are attached to the substrate(44) including the circuit pattern by gang bonding of the flexible tape extending to both sides of the chip while the metal interconnection of the flexible tape is electrically connected to the circuit pattern of the substrate. An electrical connection part with the flexible tape is sealed by an encapsulation material(45). Solder balls(46) are attached to ball lands on the lower surface of the substrate.
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