METHOD AND APPARATUS FOR SPLITTING SEMICONDUCOR WAFER

摘要

A method for splitting along streets a semiconductor wafer the surface of which is sectioned into regions with circuit by streets arranged in a lattice form. This method comprises the step of detecting the streets from the rear of the semiconductor wafer and the step of cutting the semiconductor wafer along the streets by irradiation the semiconductor wafer with a laser beam from the rear of the semiconductor wafer along the streets detected in the street detecting step.