发明名称 |
Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board |
摘要 |
A Low Temperature Co-fired Ceramic circuit board is fabricated using conductor paste and ceramic green sheet whose shrinkage factors are in the ratio 0.26 to 0.73 inclusive, when the temperature is increased from a shrinkage starting temperature to 900{C. The conductor paste may be a Silver (Ag) conductor paste including 0.005 to 0.050 % Rhodium (Rh) by weight. The green sheet may comprise a mixture of alumina and CaO-SiO2-Al2O3-B2O3 glass. |
申请公布号 |
GB0327735(D0) |
申请公布日期 |
2003.12.31 |
申请号 |
GB20030027735 |
申请日期 |
2003.07.08 |
申请人 |
SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC.;TANAKA KIKINZOKU KOGYO K K |
发明人 |
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分类号 |
H01L21/48;H01L23/498;H01L23/544;H05K1/09;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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