发明名称 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, METHODS OF MANUFACTURING THE DEVICE AND SUBSTRATE, ADHESIVE, AND ADHESIVE DOUBLE COATED FILM |
摘要 |
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25°C of from 10 to 2,000 MPa and a storage elastic modulus at 260°C of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process. |
申请公布号 |
KR20030096437(A) |
申请公布日期 |
2003.12.31 |
申请号 |
KR20017008229 |
申请日期 |
1997.10.08 |
申请人 |
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发明人 |
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分类号 |
H01L23/12;C09J163/00;H01L21/58;H01L23/13;H01L23/31;H01L23/498 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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