发明名称 Atomic layer deposition method using a novel group IV metal precursor
摘要 An atomic layer deposition method which comprises forming a metal oxide thin film by using, as a group IV metal precursor, a complex of a formula M(L)2 in which M is a group IV metal ion having a charge of +4 and L is a tridentate ligand having a charge of -2, the ligand being represented by the following formula (I):wherein each of R1 and R2, independently, is a linear or branched C1-4 alkyl group; and R3 is a linear or branched C1-5 alkylene group. The group IV metal precursor exhibits excellent thermal and chemical stabilities under a carrier gas atmosphere, whereas it has high reactivity with a reaction gas.
申请公布号 US6669990(B2) 申请公布日期 2003.12.30
申请号 US20010985690 申请日期 2001.11.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 MIN YO SEP;KIM DAE SIG;CHO YOUNG JIN;LEE JUNG HYUN
分类号 C30B25/02;(IPC1-7):C23C16/40 主分类号 C30B25/02
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