发明名称 Photolithographic methods of using a single reticle to form overlapping patterns
摘要 The invention includes a photolithographic method in which overlapping first and second exposure patterns are formed on a photosensitive material from light passed through a single reticle. The first exposure pattern of the radiation comprises features separated by about a minimum feature spacing that can be accomplished with a single reticle exposure at the time of the photolithographic processing, and the overlapping first and second patterns comprise features separated by less than the minimum feature spacing. The invention also includes a photolithographic method of forming overlapping exposure patterns on a photosensitive material from light passed through a single reticle wherein the reticle is moved between a first exposure to a first light and a second exposure to a second light.
申请公布号 US6670109(B2) 申请公布日期 2003.12.30
申请号 US20010943186 申请日期 2001.08.29
申请人 MICRON TECHNOLOGY, INC. 发明人 VAN ITALLIE JOHN F.;BYERS ERIK
分类号 G03F7/20;(IPC1-7):G03F7/213 主分类号 G03F7/20
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