发明名称 |
Dual path break before make digital circuit |
摘要 |
The present invention provides a redundant break before make digital circuit. Redundant circuits are used to provide a path to ground for a charging signal when a fault condition exists. The fault condition may be based on characteristics relating to the signal or the chip itself. For example, a fault condition may occur when a temperature measured on the chip exceeds a predetermined threshold. A fault condition may also occur when the signal is above or below a predetermined threshold. For example, a fault condition may occur when the current of the signal is above a predetermined level. The fault conditions are monitored and the state of a switch that couples the cell to the charging path is monitored. When the switch is open and a fault condition has occurred, there are redundant paths to ensure that a switch closes to provide the path to ground during the fault condition.
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申请公布号 |
US6670791(B1) |
申请公布日期 |
2003.12.30 |
申请号 |
US20020071876 |
申请日期 |
2002.02.08 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
SMITH GREGORY J.;CHEN YINMING;FURLAN IGOR |
分类号 |
H01M10/44;H01M10/46;H01M10/48;(IPC1-7):H01M10/46 |
主分类号 |
H01M10/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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