发明名称 Dual path break before make digital circuit
摘要 The present invention provides a redundant break before make digital circuit. Redundant circuits are used to provide a path to ground for a charging signal when a fault condition exists. The fault condition may be based on characteristics relating to the signal or the chip itself. For example, a fault condition may occur when a temperature measured on the chip exceeds a predetermined threshold. A fault condition may also occur when the signal is above or below a predetermined threshold. For example, a fault condition may occur when the current of the signal is above a predetermined level. The fault conditions are monitored and the state of a switch that couples the cell to the charging path is monitored. When the switch is open and a fault condition has occurred, there are redundant paths to ensure that a switch closes to provide the path to ground during the fault condition.
申请公布号 US6670791(B1) 申请公布日期 2003.12.30
申请号 US20020071876 申请日期 2002.02.08
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 SMITH GREGORY J.;CHEN YINMING;FURLAN IGOR
分类号 H01M10/44;H01M10/46;H01M10/48;(IPC1-7):H01M10/46 主分类号 H01M10/44
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