发明名称 |
Method of fabricating a CDBGA package |
摘要 |
A CDBGA package comprises a thermal dissipating substrate and a plurality of conductive bumps. A plurality of vias are formed on a circuit substrate and correspond to the conductive bumps. A plurality of ground pads, ball pads and nodes are formed on the circuit substrate, wherein the ground pads are located in the vias. A solder mask layer covers the patterned trace layer. A plurality of bonding pads are formed on a chip and are electrically connected to the nodes. A molding compound encapsulates the chip, nodes and bonding pads. A plurality of solder balls are located on the ground pads and ball pads, wherein the solder balls fill the vias and are electrically connected to the conductive bumps.
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申请公布号 |
US6670219(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20020310588 |
申请日期 |
2002.12.04 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
LEE MING-XUN;CHEN CHIN-TE |
分类号 |
H01L23/31;H01L23/36;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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