发明名称 |
Semiconductor laser device |
摘要 |
A exemplary method of fabricating a semiconductor laser device includes forming an electrode on each of a top surface and a bottom surface of a laminated structure comprised of semiconductor materials, then cleaving the laminated structure to form facets of a cavity, and next epitaxially growing a compound semiconductor on the facets of the cavity. Works involved in the cleavage and the epitaxial crystal growth are performed in a low oxygen and moisture concentration atmosphere, so that the occurrence of COD is suppressed in the fabricated semiconductor laser device.
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申请公布号 |
US6670211(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20010876278 |
申请日期 |
2001.06.06 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
OHKUBO MICHIO |
分类号 |
H01L21/00;H01L21/479;H01L29/06;H01L29/22;H01L29/221;H01S5/02;H01S5/16;H01S5/22;H01S5/40;(IPC1-7):H01L21/00;H01L5/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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