发明名称 Semiconductor laser device
摘要 A exemplary method of fabricating a semiconductor laser device includes forming an electrode on each of a top surface and a bottom surface of a laminated structure comprised of semiconductor materials, then cleaving the laminated structure to form facets of a cavity, and next epitaxially growing a compound semiconductor on the facets of the cavity. Works involved in the cleavage and the epitaxial crystal growth are performed in a low oxygen and moisture concentration atmosphere, so that the occurrence of COD is suppressed in the fabricated semiconductor laser device.
申请公布号 US6670211(B2) 申请公布日期 2003.12.30
申请号 US20010876278 申请日期 2001.06.06
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 OHKUBO MICHIO
分类号 H01L21/00;H01L21/479;H01L29/06;H01L29/22;H01L29/221;H01S5/02;H01S5/16;H01S5/22;H01S5/40;(IPC1-7):H01L21/00;H01L5/00 主分类号 H01L21/00
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