发明名称 |
Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
摘要 |
The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
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申请公布号 |
US6670101(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20020043839 |
申请日期 |
2002.01.10 |
申请人 |
DOW GLOBAL TECHNOLOGIES INC. |
发明人 |
OHBA KAORU;AKIMOTO HIDEKI;GARROU PHILIP E.;SO YING-HUNG;KALISZEWSKI BRITTON LEE |
分类号 |
B32B15/08;C08F2/44;C08F2/46;C08F290/04;C08G61/02;H05K1/03;H05K3/46;(IPC1-7):G03C5/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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