发明名称 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
摘要 The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
申请公布号 US6670101(B2) 申请公布日期 2003.12.30
申请号 US20020043839 申请日期 2002.01.10
申请人 DOW GLOBAL TECHNOLOGIES INC. 发明人 OHBA KAORU;AKIMOTO HIDEKI;GARROU PHILIP E.;SO YING-HUNG;KALISZEWSKI BRITTON LEE
分类号 B32B15/08;C08F2/44;C08F2/46;C08F290/04;C08G61/02;H05K1/03;H05K3/46;(IPC1-7):G03C5/00 主分类号 B32B15/08
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