发明名称 |
Semiconductor module and electronic component |
摘要 |
A semiconductor module achieving higher density of the semiconductor module itself as well as of being disposed in an area-efficient manner relative to another electronic component, such as a mother board and the like. The semiconductor module includes a mounting substrate having, on an underside, a solder ball for connecting to an interconnection of a mother board and semiconductor packages mounted in multiple layers on the top side of the mounting substrate and connected to electrodes on the mounting substrate.
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申请公布号 |
US6670701(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20010000031 |
申请日期 |
2001.12.04 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MATSUURA TETSUYA;KASATANI YASUSHI;MICHII KAZUNARI;MAEDA HAJIME |
分类号 |
H01L25/18;H01L23/50;H01L25/065;H01L25/10;H01L25/11;H05K1/14;H05K1/18;H05K3/34;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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