发明名称 |
Reducing hydrogen concentration in pecvd amorphous silicon carbide films |
摘要 |
The present invention provides a plasma enhanced chemical vapor deposition method and apparatus for reducing the hydrogen concentration in amorphous silicon carbide films deposited on a substrate. The process combines a noble gas such as helium with a silicon source such as silane and a carbon source such as methane in the reaction zone of a CVD chamber. The resulting silicon carbide films have a low concentration of hydrogen and high compressive stress. The films are preferably produced with a plasma generated by a mixture of high and low radio frequency.
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申请公布号 |
US6668752(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US19980098311 |
申请日期 |
1998.06.16 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
YAO XIANG YU |
分类号 |
C22B7/00;F23G5/28;F23G5/38;F26B17/00;F26B23/02;F27B9/18;(IPC1-7):C23C16/00 |
主分类号 |
C22B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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