| 摘要 |
A wire bonding device in accordance with the present invention is provided, which comprises: an XY table (2), a first holding member (8) supported by the XY table (2), a camera (9) supported by the first holding member (8), a second holding member (5) supported by the XY table (2), a capillary (7) held by the second holding member (5), a stationary base (3) for securing an object of bonding (4) in position, and a driving amount calculating unit (13) for computing the driving amount of the XY table (2) on the basis of the positional deviation of the camera (9) with respect to the origin of the XY table (2) due to temperature change in the first holding member (8) and the positional deviation of the capillary (7) with respect to the origin of the XY table (2) due to temperature change in the second holding member (5). |
