发明名称 |
System for split package power and rotational burn-in of a microelectronic device |
摘要 |
A microelectronic device is provided including an integrated circuit mounted to a substrate. A break through multiple conductive layers of the substrate corresponds to a break in the power planes of the integrated circuit. The breaks in the substrate and in the integrated circuit allow for a rotational burn-in of a first portion and a second portion of the integrated circuit.
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申请公布号 |
US6670633(B1) |
申请公布日期 |
2003.12.30 |
申请号 |
US20000751543 |
申请日期 |
2000.12.29 |
申请人 |
INTEL CORPORATION |
发明人 |
MAYBERRY MIKE |
分类号 |
G01R31/28;(IPC1-7):H01L23/48 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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