发明名称 |
Light emitting diode, light emitting device using the same, and fabrication processes therefor |
摘要 |
Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic sheet is stacked on the ceramic substrate, followed by forming electrodes in a predetermined pattern on the secondary ceramic sheet around the hole for heat sink. On the ceramic substrate, an upper ceramic sheet with an opening is stacked to form a stacked ceramic substrate in such a way that a part of the electrodes are exposed through the opening. After co-firing the stacked ceramic substrate, a light emitting diode chip is mounted on the secondary ceramic sheet at a position corresponding to the hole for heat sink. Then, the electrodes are electrically connected with the LED chip, and the LED chip is sealed with insulating resin. A light emitting device using the LED and a fabrication method therefor are also disclosed.
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申请公布号 |
US6670751(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20010981793 |
申请日期 |
2001.10.19 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SONG KYUNG-SUB;PARK YOUNG-HO;LEE CHANG-YONG |
分类号 |
H01L25/075;H01L33/62;H01L33/64;(IPC1-7):H01L33/00;H01J1/62 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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