| 发明名称 |
POLISHING SLURRY, POLISHING METHOD AND PROCESSES FOR FABRICATING SEMICONDUCTOR DEVICES |
| 摘要 |
A polishing slurry prepared by dispersing in a dispersion medium, abrasive grains comprised of a material having a solubility in the dispersion medium at 25� C., of 0.001 g/100 g or higher is used to effectively remove any abrasive grains standing adherent to the surfaces of objects to be polished or the interiors of polishing apparatus after polishing. |
| 申请公布号 |
SG100632(A1) |
申请公布日期 |
2003.12.26 |
| 申请号 |
SG20010001322 |
申请日期 |
2001.03.05 |
| 申请人 |
HITACHI, LTD. |
发明人 |
KATSUHIRO OHTA;AKIO SAITO |
| 分类号 |
B24B37/00;B24B37/04;C09G1/02;C09K3/14;C09K13/02;C09K13/04;C09K13/06;H01L21/304;H01L21/3105;(IPC1-7):C09K3/14 |
主分类号 |
B24B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
