发明名称 Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method
摘要 The invention provides a high-resolution resist material comprising an acid generator that has high sensitivity and high resolution with respect to high-energy rays of 300 nm or less, has small line-edge roughness, and is superior in heat stability and in shelf stability, and provides a pattern forming method that uses this resist material. The invention further provides a chemically amplified positive resist material comprising a base resin, an acid generator and a solvent in which the acid generator generates an alkylimidic acid containing a fluorine group, and provides a pattern forming method comprising a step of applying the resist material to the substrate, a step of performing exposure to a high-energy ray of a wavelength of 300 nm or less through a photomask following heat treatment, and a step of performing development by a developing solution following heat treatment.
申请公布号 US2003235779(A1) 申请公布日期 2003.12.25
申请号 US20030375773 申请日期 2003.02.27
申请人 HATAKEYAMA JUN;KOBAYASHI TOMOHIRO;OHSAWA YOUICHI 发明人 HATAKEYAMA JUN;KOBAYASHI TOMOHIRO;OHSAWA YOUICHI
分类号 C07C311/48;C07D333/46;C07D335/02;G03F7/004;G03F7/039;G03F7/075;(IPC1-7):G03C1/492 主分类号 C07C311/48
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