发明名称 METHOD FOR FABRICATING CAPACITOR IN SEMICONDUCTOR DEVICE
摘要 The present invention relates to a method for fabricating a capacitor in a semiconductor device; and, more particularly, to a method for fabricating a capacitor capable of stably forming a nitride layer on a lower electrode and obtaining improvements on stable capacitance and leakage current characteristics. The inventive method for fabricating a capacitor includes the steps of: forming a lower electrode on a substrate; forming a nitride-based first dielectric thin layer on the lower electrode; forming a second dielectric thin layer by depositing an Al2O3 layer on the nitride-based first dielectric thin layer; forming a third dielectric thin layer on the second dielectric thin layer; and forming an upper electrode on the third dielectric thin layer.
申请公布号 US2003235947(A1) 申请公布日期 2003.12.25
申请号 US20020316874 申请日期 2002.12.12
申请人 PARK JONG-BUM;OH HOON-JUNG;KIM KYONG-MIN 发明人 PARK JONG-BUM;OH HOON-JUNG;KIM KYONG-MIN
分类号 H01L27/04;H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L21/824;H01L21/336 主分类号 H01L27/04
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