发明名称 |
FLIP CHIP INTERCONNCETION STRUCTURE AND PROCESS OF MAKING THE SAME |
摘要 |
In a process of fabricating flip chip interconnection, a UBM layer is deposited on an I/O pad of a chip. The UBM layer includes a nickel layer. On the UBM layer is formed a tin-containing solder material. The chip is mounted on a carrier substrate by alignment of the bonding pad with a contact pad of the carrier substrate. A reflow process is performed to respectively turn the tin-containing solder material to a tin-containing solder bump and form a composite intermetallic compound on the nickel layer of the UBM to prevent its spalling. |
申请公布号 |
US2003234453(A1) |
申请公布日期 |
2003.12.25 |
申请号 |
US20030248992 |
申请日期 |
2003.03.07 |
申请人 |
LIU CHENG-YI;WANG SHEN-JIE;KAO CHENG-HENG |
发明人 |
LIU CHENG-YI;WANG SHEN-JIE;KAO CHENG-HENG |
分类号 |
H01L21/56;H01L21/60;H01L23/485;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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