| 摘要 |
<p>A Cu-Sn-O based alloy plating comprising 0.3 at % to 50 at % of oxygen, 20 at % to 80 at % of copper, and 10 at% to 70 at % of tin. The Cu-Sn-O based alloy plating provides a copper-tin alloy excellent in the adhesion of a plating and in the stability of unbuttoning force, and further provides a Cu-Sn-O based alloy plating containing no regulated material and having a black or blackish color tone.</p> |
