A PCB METHOD AND APPARATUS FOR PRODUCING LANDLESS INTERCONNECTS

摘要

An electronic assembly (10) is disclosed. The electronic assembly (10) includes a lower portion (28) and a first elongate trace (32) formed on an upper surface of the lower portion (28). The trace (32) is covered by an upper portion (26), and an opening (18) formed through an upper surface of the upper portion (26) extends to the trace (32) to expose a portion of the trace (32). A second elongate trace (20) is formed on the upper portion (26). A portion of the second elongate trace (20) positioned in the opening (18) formed through the upper surface of the upper portion (26) contacts the first elongate trace (32) through the opening (18) to form an electrical interconnection (46) between the first trace (32) and the second trace (20).