METHOD FOR EVALUATING ANOMALIES IN A SEMICONDUCTOR MANUFACTURING PROCESS

摘要

A method for determining whether a defect has previously occurred by searching a database of defect spatial signatures for a signature that matches that of a newly inspected semiconductor wafer (31). If a match occurs, an engineer is notified of the match (33). The defect spatial signature of the newly inspected wafer is added to the database of defect spatial signatures (37).