发明名称 |
LED PACKAGING METHOD AND PACKAGED LED |
摘要 |
An LED packaging method, including: forming an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region; forming an electrical insulator (20) on the peripheral region; forming an electrically conductive material (22,23) on the electrical insulator (20); mounting a semiconductor die (4) directly to the base within the receptacle (2), the die (4) incorporating at least one light emitting diode (LED); and forming one or more electrical connections (14-19) between the electrical electrically conductive material (22,23) and one or more electrical contacts of the die (4) to provide a packaged LED. |
申请公布号 |
CA2634288(A1) |
申请公布日期 |
2003.12.24 |
申请号 |
CA20032634288 |
申请日期 |
2003.06.11 |
申请人 |
LEDNIUM TECHNOLOGY PTY LIMITED |
发明人 |
JEGANATHAN, BALU;MONTAGNAT, JOHN ALBERT |
分类号 |
F21K99/00;H01L23/06;H01L23/495;H01L25/075;H01L33/62 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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