发明名称 DIE AND DIE DEVICE
摘要 <p>A die device, wherein cores (15) having discharge ports (13) communicating with die holes (9) are installed in die bodies (11) having the die holes (9) for punching out a work, a plurality of fluid jetting ports (25) jetting fluid in the lower directions of the discharge holes (13) are provided in the cores (15), the inflow ports (27) allowing the compressed fluid to flow into the fluid jetting ports (25) are provided in the die bodies (11), the cores (13) are formed of a resin and the discharge holes are formed in tapered holes larger in diameter toward the lower side, and peripheral grooves (29) communicating with the inflow ports (27) are provided in the outer peripheral surfaces of the die bodies (11).</p>
申请公布号 WO03106066(A1) 申请公布日期 2003.12.24
申请号 WO2003JP07674 申请日期 2003.06.17
申请人 AMADA COMPANY, LIMITED;NAITO, KINSHIRO;SHIMIZU, MASAYUKI;ENDO, SHIGERU;MATSUMOTO, TAKASHI;NAKAI, HIROSHI;KOBAYASHI, HIROYUKI 发明人 NAITO, KINSHIRO;SHIMIZU, MASAYUKI;ENDO, SHIGERU;MATSUMOTO, TAKASHI;NAKAI, HIROSHI;KOBAYASHI, HIROYUKI
分类号 B21D28/34;B21D45/00;B26D7/18;B26F1/40;(IPC1-7):B21D28/00;B21D45/08;B21D45/04;B21D28/36 主分类号 B21D28/34
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