METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to be capable of minimizing dry failure and to dry a water-cleaned semiconductor wafer by a Marangoni method. CONSTITUTION: A plurality of semiconductor wafers(1) are cleaned by using deionized water in a deionized water cleaning tub. Then, a drying process is carried out at the semiconductor wafers by jetting dry gas using a Marangoni drying process, while exposing the semiconductor wafers from the surface of water. At this time, the semiconductor wafers are in the tilted state. Preferably, the front surface of the semiconductor wafer is downward and the rear surface is upward. Preferably, the semiconductor wafer has a tilted angle of 4-10 degrees.