FLIP APPARATUS FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A flip apparatus for a semiconductor package is provided to be capable of improving productivity by controlling a plurality of semiconductor packages at a time. CONSTITUTION: A flip apparatus for a semiconductor package is provided with the first flip unit(100) having the first frame and the first header assembly(120) for adsorbing at least one semiconductor package, the second flip unit(200) having the second frame and the second head assembly(220) for receiving the adsorbed semiconductor package from the first header assembly, and a plurality of lift parts(300) installed at the first and second flip unit for moving the first and second header assembly up and down. The flip apparatus further includes a plurality of horizontally moving parts installed at a base plate spaced apart from each one side of the first and second frame for moving the first and second header assembly to and fro.