发明名称 THIN FILM-FORMING APPARATUS
摘要 A thin film-forming apparatus where raw material gas is uniformly supplied on a substrate surface and the thickness of an organic thin film can be uniformly formed on the substrate surface. The thin film-forming apparatus comprises a vacuum chamber (11), a substrate holder (12) provided in the vacuum chamber (11), and a gas supply end (22) for supplying gas to a substrate mounting face (12a) of the substrate holder (12). The apparatus is characterized in that the gas supply end (22) is formed such that the raw material gas is supplied to the substrate mounting face (12a) in an elongate shape.
申请公布号 WO03106730(A1) 申请公布日期 2003.12.24
申请号 WO2003JP07669 申请日期 2003.06.17
申请人 SONY CORPORATION;SASAKI, KOJI;NARUI, HIRONOBU;YANASHIMA, KATSUNORI;MEMEZAWA, AKIHIKO 发明人 SASAKI, KOJI;NARUI, HIRONOBU;YANASHIMA, KATSUNORI;MEMEZAWA, AKIHIKO
分类号 H05B33/10;C23C14/12;C23C14/24;C23C16/455;H01L51/50;(IPC1-7):C23C14/12;H05B33/14 主分类号 H05B33/10
代理机构 代理人
主权项
地址
您可能感兴趣的专利