发明名称 SUPPRESSION FEEDTHRU INSULATOR ASSEMBLY STRUCTURE OF SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PURPOSE: A suppression feedthru insulator assembly structure of a semiconductor manufacturing apparatus is provided to be capable of replacing an exposed insulating part of a suppression feedthru part for minimizing the contamination of the exposed insulating part. CONSTITUTION: A suppression feedthru insulator assembly structure of a semiconductor manufacturing apparatus is provided with the first insulating part(21) formed at the inner portion of a suppression feedthru part and the second insulating part(31) connected with the first insulating part. At this time, the second insulating part is capable of being detached from the first insulating part. The suppression feedthru insulator assembly structure further includes a contamination preventing part(40) for enclosing the exposed portion of the first insulating part.
申请公布号 KR20030095512(A) 申请公布日期 2003.12.24
申请号 KR20020032751 申请日期 2002.06.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JAE HO;SONG, YONG UK
分类号 H01L21/265;(IPC1-7):H01L21/265 主分类号 H01L21/265
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