POLISHER

摘要

A polisher (10) for polishing the surface of a semiconductor wafer (W) has at least a polishing pad (11) containing abrasive grains. A polishing solution supply unit (14) is composed of a first storage tank (17) where a first liquid is stored, a second storage tank (18) where a second liquid is stored, a mixing section (19) connected to the first and second tanks (17, 18) and adapted for producing a polishing solution by mixing the first and second liquids, and a supply section (20) for supplying the polishing solution to the contact portion where the polishing pad (11) is in contact with the semiconductor wafer (W) directly after the polishing solution is produced at the mixing section (19). Thus, foreign matters are not mixed, and the semiconductor wafer is polished without being adversely influenced by them.