Forming holes in a flat polymer material circuit board substrate, involves initially forming blind holes, and then removing the material at the bottom using a laser

摘要

A process for forming holes in a flat, polymer material, circuit board substrate (1), involves forming blind holes (3) at the penetrating hole (6) locations. The material (4) at the bottom of the blind holes is later removed using a laser beam (5) whose diameter is at least as large as the blind hole diameter. A process for forming holes in a flat, polymer material, circuit board substrate (1), involves forming blind holes (3) at the penetrating hole (6) locations. The material (4) at the bottom of the blind holes is later removed using a laser beam (5) whose diameter is at least as large as the blind hole diameter. The laser beam diameter is chosen so that it covers the blind hole, even after taking into account positional tolerance. The substrate and its blind holes are formed in a single injection molding stage, and the substrate consists of a polymer film.