| 摘要 |
Embodiments of stackable packages for an electronic device, such as an integrated circuit chip or a micro-machine, are disclosed. The packages may be stacked and electrically interconnected without soldering. The package includes a molded plastic body. Stacking clips are molded into the package body. Leads formed of spring metal are embedded at the bottom of the package so that a surface of the lead is exposed through the mold compound. The leads extend upwards adjacent to the sides of the package body, and extend over the top surface of the package body. A spring member, such as a crook spring, is bent into the leads. The spring member, along with the inherent spring of the spring metal, causes the leads to press against juxtaposed lead portions of a package stacked therewith, which forces the leads of the two packages against each other, thereby forming a secure electrical connection between the packages. A tool for disengaging the interconnected clips of stacked packages also is described.
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